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广积科技(上海)有限公司 IBASE
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CompactPCI卡
Mobile Intel® Pentium® III Processor-M-based 6U CompactPCI Board

SPECIFICATIONS

CPU
Mobile Intel® Celeron® Processor / Mobile Intel® Pentium® III Processor-M (BGA2)
(low power, low voltage, no CPU fan)
400MHz ~ 700MHz

CPU Front Side Bus
100MHz

Chipset
Intel® 440BX AGPset
Intel® 82443BX Host Bridge/Controller
Intel® 82371EB (PIIX4) 324-pin BGA

L2 Cache
128K/256K CPU integrated

BIOS
Award Flash BIOS

System Memory
Two (2) DIMM sockets
Supports up to 512MB memory capacity
PC100 SDRAM modules type

VGA
SMI SM721G4/G8 with 4MB/8MB embedded memory
Supports CRT & LCD displays
Dual independent display

Ethernet
Two (2) Intel® 82559 Fast Ethernet controllers
10BaseT/100BaseTX, full duplex
Two RJ-45 connectors, Link/Active LEDs on board
Complies with IEEE802.3, IEEE 802.3x Ethernet specifications

Super I/O
Winbond 83977 Super I/O chipset
Supports IrDA x 1, Parallel x 1, COM1, COM2, FDC (2.88MB, 3 Mode), keyboard and mouse
Front side I/O connectors include COM1, COM2 and LPT1 Dsub type; all other signals supported on the rear panel

PCI to PCI Bridge
TI TI2020 / Intel® 21150 PCI to PCI Bridge chipset
32 bit operation

PMC Connector
On board PMC connector supports optional Ethernets, PCI SCSI devices, etc.

USB
Two (2) USB ports on the front panel

Solid State Disk Interface
Onboard DiskOnChip socket supports M-Systems DiskOnChip flash disk of 2MB~144MB capacity

Keyboard and Mouse Connector
Combo PS/2 type (keyboard & mouse)

Form Factor
6U Compact PCI Board
Single-slot: 0.8" (20.3mm)

Dimensions
233mm x 160mm (9.2" x 6.3")

ENVIRONMENTAL FACTORS

Operating Temperature:
0?C~60?C (32?F~140?F)

Storage Temperature:
-20?C~80?C (-68?F~176?F)

Relative Humidity:
10%~90% (non-condensing)
联系方式
广积科技(上海)有限公司 IBASE
地址：中山西路2368号华鼎大厦16层
电话： 请点击此处与厂家联系
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